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Suppra Bond A Plus

FDA UDI

Class II (US FDA UDI)

by Dentscare Ltda

Identity

Trade Name
Suppra Bond A Plus FDA UDI
Generic Name
Dentine bonding agent/set FDA UDI
Device Name
Suppra Bond A Plus is a light-curing 5th generation adhesive (two-step adhesive, total etch technique) for bonding restorative materials to dental tissue (enamel and/ or dentin). FDA UDI
Model / Reference
6mL FDA UDI
Description
Suppra Bond A Plus is a light-curing 5th generation adhesive (two-step adhesive, total etch technique) for bonding restorative materials to dental tissue (enamel and/ or dentin). FDA UDI

Identifiers

Catalog Number
4000055480 FDA UDI
Primary DI / UDI-DI
07899633828364 FDA UDI
FDA Product Code
KLE FDA UDI
GMDN Term
Dentine bonding agent/set FDA UDI

Classification

Device Class
Class II FDA UDI
Regulation Number
872.3200 FDA UDI
Commercial Distribution
In Commercial Distribution FDA UDI

Clinical & Handling

Sterile

No

FDA UDI

Single Use

No

FDA UDI

Implantable

No

FDA UDI

Contains Latex

No

FDA UDI

Prescription Use

Yes

FDA UDI

Over-the-Counter

No

FDA UDI

Convenience Kit

No

FDA UDI

Combination Product

No

FDA UDI

HCT/P

No

FDA UDI

Premarket Exempt

No

FDA UDI

Lot / Batch Number

Yes

FDA UDI

Serial Number

No

FDA UDI

Expiration Date

Yes

FDA UDI

Manufacturing Date

Yes

FDA UDI

Category: Dentine bonding agent/set

Suppra Bond A Plus by Dentscare Ltda — Class II — FDA UDI — listed in FDA GUDID — regulatory data on deviCERTS

Similar devices

Also classified as Dentine bonding agent/set.

Authorization Coverage (1 country)

Regulatory Authorizations

United States Pending data

FDA UDI

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Manufacturer

Manufacturer
Dentscare Ltda

Sources (1)

  • FDA UDI 3797c1fd-86d8-42eb-8be1-5f44193d0029 34 fields · synced May 30, 2026